In recent years, the global economic growth rate has slowed down, and the market environment in various industries is not very good. So what are the future prospects of COB packaging?
First, let's briefly talk about COB packaging. COB packaging technology involves directly soldering light-emitting chips onto a PCB board, then laminating them as a whole to form a unit module, and finally splicing them together to form a complete LED screen. The COB screen is a surface light source, so the visual appearance of the COB screen is better, with no graininess, and is more suitable for long-term close-up viewing. When viewed from the front, the viewing effect of COB screen is closer to that of LCD screen, with bright and vibrant colors and better performance in details.
COB not only solves the traditional physical limit problem of SMD (which can lower the point spacing to below 0.9, meeting the needs of new display Mini/Micro LEDs), but also enhances product stability and reliability, especially in the field of Micro LED applications, which will dominate and have a very broad prospect.
At present, Mini LED display products using COB packaging technology are gradually gaining popularity. In recent years, indoor small and micro spacing engineering has been widely used, and standardized display devices such as LED all-in-one machines and LED TVs with medium and large sizes are showing strong growth momentum. Another new display technology product of COB packaging technology, Micro LED, is also about to enter the mass production stage. After the global economy recovers, the COB related technology product market may usher in greater development opportunities.
Due to the high threshold for COB packaging production technology and the fact that it has not yet been widely applied nationwide, the future market prospects are still promising. However, if manufacturers want to seize this opportunity, they still need to continuously improve their technical level.
Post time: Feb-19-2024
